The following are the headlines:-

Leading edge surface mount capability (0402, micro BGA & large BGA placed in volume)

New Product Introduction (NPI) facility for Small Batch and Prototype production and evaluation facilities

Surface mount pick and place
· Panasonic (11 lines)
MV2F / MV2VB / MSHIII / MPVA2B / MPA-3 / MPA80

In line surface mount paste volume checking
· 4 x CyberSentry 2000

Forced Convection / Infra Red reflow (450mm width)
· BTU
· Heller
· Electrovert
· Vitronics
· Omiflow

Vacuum Vapour phase reflow
· Asscon VP6000

BGA rework
· 2 x Conceptronic 2000
· Metcal BGA 3000

Automatic Through Hole DIP, Axial and Radial insertion (with sequencers)
· Universal (2 lines)

Computer Controlled Laser Guided manual insert lines

Multi stage manual insertion (several lines)

Chip and leaded wave soldering (400mm, spray fluxers)
· 5 x Seho 8340
· Electrovert
· Sensby
· Blundell

Hand soldering

Custom box assembly lines as required

Comprehensive range of assembly processes including
· Single and double sided surface mount
· Solder-paste or adhesive dot or both

Soldering processes
· Low-solids, no-clean fluxes
· Full clean processes with ionic contamination measurement
· Automatic stencil cleaning
· Low-dross wave solder
· Dross reclamation

Leaded component perform, insert and crop

Semi-automatic connector riveting

Press-fit connector insertion for backplanes

Environmental Stress Screening -70ºC to 150ºC. Ramp rate 50ºC / minute
· Sharetree Cyclone (liquid Nitrogen cooled)

Conformal Coating by automatic spray and dipping and manual dipping and application
· Blundell PVA 550 auto sprayer
· Concoat DC2000 auto dip equipment

Inspection Equipment
· X-Tek CPXS 3-D X-ray
· CyberOptics Cybersentry Paste Volume Inspection
· 5 x DiagnoSYS Automatic Optical Inspection (AOI)
· Vision Equipment Mantis and Cobra microscopes

Ancillary plant and equipment
extensive range for baking, ultrasonic cleaning, rework, de-ionised water generation, de-panelling etc.